Patent Assignment
Reel/Frame 027824/0304
Assignment of Assignor's Interest
Recorded: 2012-02-13
Pages: 3
Assignor
WAKABAYASHI, YOSHIHAKI
Executed: 2012-02-07
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, 108-8001, JAPAN
Covered Property
(1)
Semiconductor Device Having Shield Layer and Chip-Side Power Supply Terminal Capacitively Coupled Therein