Patent Assignment
Reel/Frame 027824/0360
Assignment of Assignor's Interest
Recorded: 2012-02-10
Pages: 2
Assignors
KANG, JI-HYEON
Executed: 2012-02-09
LEE, HYUN-CHUL
Executed: 2012-02-09
LIM, WON-KYU
Executed: 2012-02-09
Assignee
SAMSUNG MOBILE DISPLAY CO., LTD.
SAN #24 NONGSEO-DONG, GIHEUNG-GU,, YONGIN-CITY, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method and Apparatus for Cutting a Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.