Method and apparatus for cutting a substrate

1. A substrate cutting apparatus for cutting a large size substrate into smaller unit substrates, the apparatus comprising:

a rotating table on which the large size substrate having formed thereon a plurality of cutting lines is mountable, the cutting lines being spaced apart from each other by a predetermined distance, the rotating table including a plurality of spaced apart rotating shafts at locations aligned with the cutting lines, the rotating shafts being spaced from each other a distance corresponding to the predetermined distance that the cutting lines are spaced from each other; and

a number of push plates, each of the push plates to apply a pressure to the large size substrate on the rotating table, wherein the number of push plates is less than the plurality of cutting lines and wherein:

a first cutting line is on a first surface of the large size substrate, and second and third cutting lines are on a second surface of the large size substrate,

the first cutting line is between adjacent push plates,

the adjacent push plates are between the second and third cutting lines, and

the rotating table rotates in a first direction at a first location to separate the large size substrate along the first cutting line, and rotates in a second direction opposite to the first direction at second and third locations to respectively separate the large size substrate along the second and third cutting lines.

2. The substrate cutting apparatus of claim 1 , wherein the plurality of spaced apart rotating shafts includes:

a first rotating shaft at the first location for rotating the rotating table in the first direction about a first axis of rotation into a first angular position, the first rotating shaft corresponding with the first axis of rotation of the rotating table, and

second rotating shafts at the second and third locations, each of the second rotating shafts for rotating the rotating table in the second direction about second axes of rotation into a second angular position, the second rotating shafts corresponding with the second axes of rotation of the rotating table.

3. The substrate cutting apparatus of claim 2 , wherein the first rotating shaft and the second rotating shafts are alternately arranged on the rotating table.

4. The substrate cutting apparatus of claim 1 , further comprising

a suction pump for applying suction force via penetration holes in the rotating table toward the large size substrate mountable on the rotating table.

5. A method of cutting a substrate, the method comprising:

performing a scribing operation to form a plurality of cutting lines on a large size substrate according to a size of a plurality of smaller unit substrates to be formed;

performing a fixing operation using a number of push plates for fixing the large size substrate, on which the cutting lines are formed, to a rotating table, the rotating table having a plurality of rotating shafts corresponding to the cutting lines; and

performing a cutting operation for cutting the plurality of smaller unit substrates from the large size substrate along the cutting lines by rotating the rotating table around the plurality of rotating shafts, wherein the number of push plates is less than the plurality of cutting lines and wherein:

a first cutting line is on a first surface of the large size substrate, and second and third cutting lines are on a second surface of the large size substrate,

the first cutting line is between adjacent push plates,

the adjacent push plates are between the second and third cutting lines, and

the rotating table rotates in a first direction about a first shaft to separate the large size substrate along the first cutting line, and rotates in a second direction opposite to the first direction about second shafts to separate the large size substrate along the second and third cutting lines.

6. The method of claim 5 , wherein the fixing operation further comprises fixing the large size substrate to the rotating table by pushing the large size substrate toward the rotating table.

7. The method of claim 6 , further comprising applying suction force to the large size substrate via penetration holes in the rotating table.

8. The method of claim 5 , wherein the rotating table is rotated simultaneously around the plurality of rotating shafts.

9. The method of claim 5 , wherein the rotating table is rotated around ones of the plurality of rotating shafts at different times.

10. The method of claim 5 , wherein the:

the rotating table rotates about the first shaft into a first angular disposition pointing in the first direction, and

the rotating table rotates into a second angular disposition pointing in the second direction about the second shafts.

11. The method of claim 10 , wherein the first rotating shafts and the second rotating shafts are alternately arranged on the rotating table.

12. The method of claim 5 , wherein the scribing operation includes alternately forming the cutting lines on the first surface and the second surface of the large size substrate and wherein the first surface is a top surface and the second surface is a bottom surface of the large size substrate.

13. The method of claim 12 , wherein the cutting lines are sequentially formed on the top surface and the bottom surface of the large size substrate.

14. The method of claim 12 , wherein the cutting lines are simultaneously formed on the top surface and the bottom surface of the large size substrate.

15. The substrate cutting apparatus of claim 1 , wherein the plurality of rotating shafts include:

a first rotating shaft for rotating the rotating table in a “V” form facing a first direction, and

second rotating shafts for rotating the rotating table in a reverse “V” form facing a second direction, wherein the first direction is opposite to the second direction.

16. The substrate cutting apparatus of claim 1 , wherein the first surface is a top surface and the second surface is a bottom surface of the large size substrate.