Patent Assignment
Reel/Frame 027824/0886
Assignment of Assignor's Interest
Recorded: 2012-03-08
Pages: 2
Assignee
SAMSUNG TECHWIN CO., LTD.
28 SUNGJU-DONG, KYONGSANGNAM-DO, CHANGWON-CITY, KOREA, REPUBLIC OF
Covered Property
(1)
Circuit Board and Method of Manufacturing the Same
Application:
13/414,793 →
Publication:
US 2012/0298409
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.