Patent Assignment
Reel/Frame 027827/0596
Assignment of Assignor's Interest
Recorded: 2012-03-08
Pages: 5
Assignors
NALLA, RAVI K.
Executed: 2010-09-16
MANUSHAROW, MATHEW J.
Executed: 2010-09-17
MALATKAR, PROMOD
Executed: 2010-09-21
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Methods of Forming Fully Embedded Bumpless Build-Up Layer Packages and Structures Formed Thereby
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.