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Patent Assignment
Reel/Frame 027831/0809

Corrective Assignment to Correct the Name of the Assignor on the Assignment Document Previously Recorded on Reel 025607 Frame 0654. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest.

Recorded: 2012-03-08 Pages: 4
Assignor
GAUDIN, GWELTAZ
Executed: 2010-10-21
Assignee
S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
PARC TECHNOLOGIQUE DES FONTAINES, CHEMIN DES FRANQUES, 38190 BERNIN, FRANCE
Covered Property (1)
Low-Temperature Bonding Process
Patent: 8,790,992 →
Application: 12/904,744 →
Publication: US 2012/0043647
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 10, 2011
From: GAUDIN, M. GWELTAZ
To: S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
Reel/Frame 025607/0654 →
Change of Name Mar 4, 2012
From: S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
To: SOITEC
Reel/Frame 027800/0911 →