Patent Assignment
Reel/Frame 027841/0183
Change of Name
Recorded: 2012-03-12
Pages: 10
Assignor
W.C. HERAEUS GMBH & CO. KG
Executed: 2004-08-26
Assignee
W.C. HERAEUS GMBH
HERAEUSSTRASSE 12-14, HANAU, 63450, GERMANY
Covered Property
(1)
Film Used as a Substrate for Integrated Circuits
Patent:
6,420,660 →
Application:
09/445,235 →
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 8, 1999
From: SAUER, VERONIKA; SLAGER, BEN; LACH, FRIEDRICH; BAUER, ALFRED
To: U.S. PHILIPS CORPORATION
Reel/Frame 010529/0476 →
Assignment of Assignor's Interest
Jul 20, 2009
From: U.S. PHILIPS CORPORATION
To: NXP B.V.
Reel/Frame 022973/0397 →
Corrective Assignment to Correct the Assignment Cover Sheet of the Name and Address of Receiving Parties. Co-Assignees Had Been Erroneously Omitted, Previously Recorded on Reel 010529 Frame 0476. Assignor(S) Hereby Confirms the Receiving Parties Are: U.S. Philips Corporation, W.C. Heraeus Gmbh & Co Kg, and Nedcard B.V..
Feb 13, 2012
From: SAUER, VERONIKA; SLAGER, BEN; LACH, FRIEDRICH; BAUER, ALFRED
To: U.S. PHILIPS CORPORATION; W.C. HERAEUS & CO KG.; NEDCARD B.V.
Reel/Frame 027697/0331 →
Change of Name
Mar 13, 2012
From: W.C. HERAEUS GMBH
To: HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG.
Reel/Frame 027850/0054 →
Change of Name
May 19, 2015
From: HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 035744/0381 →
Assignment of Assignor's Interest
Sep 22, 2017
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: PHILIPS SEMICONDUCTORS INTERNATIONAL B.V.
Reel/Frame 043951/0127 →
Change of Name
Sep 22, 2017
From: PHILIPS SEMICONDUCTORS INTERNATIONAL B.V.
To: NXP B.V.
Reel/Frame 043951/0611 →