Patent Assignment
Reel/Frame 035744/0381
Change of Name
Recorded: 2015-05-19
Pages: 12
Assignor
HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
Executed: 2014-12-29
Assignee
HERAEUS DEUTSCHLAND GMBH & CO. KG
HERAEUSSTR. 12-14, HANAU, 63450, GERMANY
Covered Properties
(63)
Warp-Knit Fabric of Noble Metal-Containing Wires, and Method for the Production Thereof
Patent:
6,089,051 →
Application:
08/149,980 →
Bath for the Electrodeposition of Palladium-Silver Alloys
Patent:
5,549,810 →
Application:
08/503,589 →
Cobalt Base Alloy Sputtering Target with High Magnetic Field Penetration
Patent:
6,372,104 →
Application:
08/572,792 →
Method of Manufacturing an Electrically Conductive Cermet
Patent:
5,796,019 →
Application:
08/583,516 →
Crucible for Growing Single Crystals, Process for Making the Same and Use of the Same
Patent:
5,993,545 →
Application:
09/005,327 →
Fine Wire of Gold Alloy, Method for Manufacture Thereof and Use Thereof
Patent:
6,103,025 →
Application:
09/110,905 →
Method for Manufacturing a Welded Shaped Body Dispersion-Hardened Platinum Material
Patent:
6,129,997 →
Application:
09/266,142 →
Fine Wire Made of a Gold Alloy, Method for Its Production, and Its Use
Patent:
6,242,106 →
Application:
09/305,767 →
Method for Producing a Lead-Free Substrate
Patent:
6,352,634 →
Application:
09/445,196 →
Film Used as a Substrate for Integrated Circuits
Patent:
6,420,660 →
Application:
09/445,235 →
Method and Device for Producing Soft Solder Powder
Patent:
6,290,745 →
Application:
09/485,917 →
Method for Encapsulating Solder Metal Powders and Solder Metal Powders Produced According to This Method
Patent:
6,416,863 →
Application:
09/719,281 →
Device for Producing Soft Solder
Gold-Free Platinum Material Dispersion-Strengthened by Small, Finely Dispersed Particles of Base Metal Oxide
Method and Apparatus for Reducing Nitrous Oxide
Process for Producing a Tube-Shaped Cathode Sputtering Target
Module for a Data Carrier with Improved Bump Counterparts
High Temperature-Resistant Niobium Wire
Contact Arrangement and Use Thereof
Electrode System with a Current Feedthrough Through a Ceramic Component
Method for Refining and Homogeneously Distributing Alloying Partners and for Removing Undesirable Reaction Products and Slags in or from Soft Solder During the Production of Fine Solder Powder
No-Clean Low-Residue Solder Paste for Semiconductor Device Applications
Oxygen-Enriched Niobium Wire
Copper Bonding or Superfine Wire with Improved Bonding and Corrosion Properties
Doped Iridium with Improved High-Temperature Properties
Pt or Pt Alloy Materials Hardened by Oxide Dispersion, Produced by Inner Oxidation and Having Proportions of Oxide and Good Ductility
Pt/Pd Alloy Wires, Strips or Reshaped Parts Hardened by Oxide Dispersion, and Process of Producing the Same
Solder Pastes Comprising Nonresinous Fluxes
Spool Wound with a Gold Alloy Wire Used for a Bonding Process
Method for the Decomposition of N2O in the Ostwald Process
Connecting Wire and Method for Manufacturing Same
Increasing the Strength of Iridium, Rhodium, and Alloys Thereof
Material Comprised of Metal and Lactic Acid Condensate and Electronic Component
Application:
13/060,151 →
Publication:
US 2011/0151268
Use of Aliphatic Hydrocarbons and Paraffins as Solvents for Silver Sinter Pastes
Application:
13/224,478 →
Publication:
US 2012/0055707
Contacting Means and Method for Contacting Electrical Components
Sputtering Target Having Amorphous and Microcrystalline Portions and Method of Producing Same
Tube-Shaped Sputtering Target
Optoelectronic Component
Thin Film Transistor (Tft) Having Copper Electrodes
Metal Paste with Oxidizing Agents
Metal Paste with Co-Precursors
Method for Manufacturing a Partially Coated Carrier Structure
Paste and Method for Connecting Electronic Component to Substrate
Application:
13/604,687 →
Publication:
US 2013/0068373
Bonding Wire for Semiconductor Devices
Application:
13/680,871 →
Publication:
US 2013/0126934
Doped 4N Copper Wires for Bonding in Microelectronics Devices
Application:
13/688,722 →
Publication:
US 2013/0142567
Secondary Alloyed 1N Copper Wires for Bonding in Microelectronics Devices
Application:
13/688,784 →
Publication:
US 2013/0140068
3N Copper Wires with Trace Additions for Bonding in Microelectronics Devices
Application:
13/690,343 →
Publication:
US 2013/0142568
Alloyed 2N Copper Wires for Bonding in Microelectronics Devices
Core-Jacket Bonding Wire
Contact Piece Containing Precious Metal on a Spring Support Having a Rotationally Symmetrical Bending Moment
Application:
13/824,770 →
Publication:
US 2013/0187495
Planar or Tubular Sputtering Target and Method for the Production Thereof
REDUCTION OF THE EVAPORATION RATE OUT OF PLATINUM AND Pt ALLOYS
Application:
13/878,434 →
Publication:
US 2013/0186146
Catalyst
Catalyst
Zirconium-Based Alloy Metallic Glass and Method for Forming a Zirconium-Based Alloy Metallic Glass
Method for Partial Lamination of Flexible Substrates
Application:
13/984,570 →
Publication:
US 2013/0316122
Silver Alloy Wire for Bonding Applications
Application:
14/015,119 →
Publication:
US 2014/0063762
Wire for Sliding Contacts, and Sliding Contacts
Application:
14/126,080 →
Publication:
US 2014/0120743
Flat Structure, Particularly Textile, Containing Precious Metal Wire
Application:
14/374,028 →
Publication:
US 2015/0038034
Aluminum Coated Copper Ribbon
Aluminum Coated Copper Bond Wire and Method of Making the Same
Aluminum Coated Copper Bond Wire and Method of Making the Same
Application:
14/399,446 →
Publication:
US 2015/0098170
Method of Joining Components Using Metal Paste with Oxidizing Agents
Application:
14/508,585 →
Publication:
US 2015/0021378
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 10, 1993
From: GORYWODA, MAREK; HORMANN, MICHAEL; LINDENMAYER, GUNTER; LUPTON, DAVID F.
To: W.C. HERAEUS GMBH
Reel/Frame 006771/0834 →
Assignment of Assignor's Interest
Jul 18, 1995
From: HERKLOTZ, GUNTER; FREY, THOMAS; CAMUS, OTTO
To: W.C. HERAEUS GMBH
Reel/Frame 007582/0790 →
Assignment of Assignor's Interest
Dec 15, 1995
From: SCHLOTT, MARTIN; HEINDEL, JOSEF
To: LEYBOLD MATERIALS GMBH
Reel/Frame 007808/0916 →
Assignment of Assignor's Interest
Jan 5, 1996
From: LUPTON, DAVID FRANCIS; SCHIELKE, JORG; GRAF, HANS-JOACHIM; RECKZIEGEL, ARNO
To: W.C. HERAEUS GMBH; FRIATEC AG
Reel/Frame 007822/0091 →
Corrective Assignment to Correct the Address of the Assignee Recorded on Reel 7582, Frame 790.
Jan 16, 1996
From: HERKLOTZ, GUNTER; FREY, THOMAS; CAMUS, OTTO
To: HERAEUS, W.C. GMBH
Reel/Frame 007850/0658 →
Assignment of Assignor's Interest
Jan 9, 1998
From: LUPTON, DAVID FRANCIS; SCHIELKE, JORG; WEIGELT, MANFRED; PETERMANN, KLAUS
To: W.C. HERAEUS GMBH
Reel/Frame 008953/0913 →
Assignment of Assignor's Interest
Jul 6, 1998
From: HERKLOTZ, GUNTHER; REUEL, JURGEN; SCHRAPLER, LUTZ; SIMONS, CHRISTOPH
To: W.C. HERAEUS GMBH
Reel/Frame 009305/0203 →
Assignment of Assignor's Interest
Mar 10, 1999
From: BRAUN, FRANZ; KOCK, WULF; LUPTON, DAVID FRANCIS
To: W.C. HERAEUS GMBH & CO. KG
Reel/Frame 009820/0864 →
Change of Name
Apr 19, 1999
From: W.C. HERAEUS GMBH
To: W.C. HERAEUS GMBH & CO. KG
Reel/Frame 009912/0810 →
Change of Name
Apr 22, 1999
From: W. C. HERAEUS GMBH
To: W.C. HERAEUS GMBH & CO. KG.
Reel/Frame 009968/0936 →
Assignment of Assignor's Interest
Aug 27, 1999
From: HERKLOTZ, GUNTER; SCHRAPLER, LUTZ; SIMONS, CHRISTOPH; REUEL, JURGEN
To: W.C. HERAEUS GMBH & CO. KG
Reel/Frame 010207/0889 →
Assignment of Assignor's Interest
Dec 8, 1999
From: SAUER, VERONIKA; SLAGER, BEN; LACH, FRIEDRICH; BAUER, ALFRED
To: U.S. PHILIPS CORPORATION
Reel/Frame 010529/0476 →
Assignment of Assignor's Interest
Feb 1, 2000
From: FORDERER, HEINZ; FREY, THOMAS; HERKLOTZ, GUNTER
To: W.C. HERAEUS GMBH & CO. KG
Reel/Frame 010580/0759 →
Assignment of Assignor's Interest
Jul 30, 2001
From: FRIATEC AG
To: W.C. HERAEUS GMBH & CO. KG
Reel/Frame 012025/0603 →
Assignment of Assignor's Interest
Sep 4, 2001
From: MANHARDT, HARALD; LUPTON, DAVID FRANCIS; KOCK, WULF
To: W.C. HERAEUS GMBH & CO. KG
Reel/Frame 012147/0425 →
Assignment of Assignor's Interest
Dec 17, 2001
From: GORYWODA, MAREK; LUPTON, DAVID FRANCIS; LUND, JONATHAN
To: W.C. HERAEUS HOLDING GMBH & CO. KG
Reel/Frame 012594/0344 →
Assignment of Assignor's Interest
Feb 27, 2002
From: HECK, RALF; JUTTNER, RAINER; LUPTON, DAVID; MAIER, EGON
To: W.C. HERAEUS GMBH & CO. KG
Reel/Frame 012659/0064 →
Merger
May 7, 2004
From: LEYBOLD MATERIALS GMBH
To: UNAXIS MATERIALS DEUTSCHLAND GMBH
Reel/Frame 014601/0972 →
Merger
May 14, 2004
From: UNAXIS MATERIALS DEUTSCHLAND GMBH
To: HERAEUS THINFILM MATERIALS GMBH
Reel/Frame 014624/0934 →
Merger
May 24, 2004
From: HERAEUS THINFLIM MATERIALS GMBH
To: W.C. HERAEUS GMBH & CO. KG
Reel/Frame 014662/0123 →
Assignment of Assignor's Interest
Oct 14, 2004
From: MOLL, RAINER; RABE, MICHAEL
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 016692/0346 →
Assignment of Assignor's Interest
Apr 19, 2005
From: GEHLERT, BERND; PAULSEN, ROLF
To: W.C. HERAEUS GMBH
Reel/Frame 015914/0437 →
Assignment of Assignor's Interest
May 12, 2005
From: WEILAND, REINHOLD; MANHARDT, HARALD; LUPTON, DAVID
To: W.C. HERAEUS GMBH
Reel/Frame 016006/0021 →
Assignment of Assignor's Interest
Jun 2, 2005
From: SPANIOL, BERND
To: W.C. HERAEUS GMBH
Reel/Frame 016300/0328 →
Assignment of Assignor's Interest
Nov 29, 2005
From: WELCO GMBH
To: W.C. HERAEUS GMBH
Reel/Frame 017073/0753 →