Optoelectronic component
View Patent ↗An optoelectronic component including a connection carrier including an electrically insulating film at a top side of the connection carrier, an optoelectronic semiconductor chip at the top side of the connection carrier, a cutout in the electrically insulating film which encloses the optoelectronic semiconductor chip, and a potting body surrounding the optoelectronic semiconductor chip, wherein a bottom area of the cutout is formed at least regionally by the electrically insulating film, the potting body extends at least regionally as far as an outer edge of the cutout facing the optoelectronic semiconductor chip, and the cutout is at least regionally free of the potting body.
1. An optoelectronic component comprising:
a connection carrier comprising an electrically insulating film at a top side of the connection carrier,
an electrically conducting film,
an optoelectronic semiconductor chip at the top side of the connection carrier,
a cutout in the electrically insulating film which encloses the optoelectronic semiconductor chip, and
a potting body surrounding the optoelectronic semiconductor chip, wherein
a bottom area of the cutout is formed at least regionally by the electrically insulating film,
the potting body extends at least regionally as far as an outer edge of the cutout facing the optoelectronic semiconductor chip,
the cutout is at least regionally free of the potting body,
the electronically conducting film comprising at least two regions insulated from each other and held together by the electrically insulating film,
the electrically insulating film completely covers the electrically conducting film at a top side apart from a first connection region and a second connection region,
the optoelectronic semiconductor chip is arranged on the electrically conducting film in the first connection region,
the optoelectronic semiconductor chip is electrically contact connected to the electrically conducting film in the second connection region,
the cutout encloses the first and the second connection regions, and
wherein the electrically insulating film covers the electrically conducting film exclusively at the top side.
2. The optoelectronic component according to claim 1 , wherein the cutout is substantially free of the potting body.
3. The optoelectronic component according to claim 1 , wherein the potting body extends along an entirety of the cutout to the outer edge of the cutout facing the optoelectronic semiconductor chip.
4. The optoelectronic component according to claim 1 , wherein the cutout does not penetrate through the electrically insulating film.
5. The optoelectronic component according to claim 1 , wherein the connection carrier comprises an electrically conducting film fixed to the electrically insulating film at a side of the electrically insulating film facing away from the top side of the connection carrier.
6. The optoelectronic component according to claim 1 , wherein the connection carrier consists of the electrically conductive film, the electrically insulating film and a connector, wherein the connector is arranged between the electrically conductive film and the electrically insulating film.
7. The optoelectronic component according to claim 1 , wherein the potting body is produced by dispensing and the outer edge of the cutout forms a stop edge for the potting body.
8. The optoelectronic component according to claim 1 , wherein the cutout is produced by a laser beam.
9. The optoelectronic component according to claim 1 , wherein the cutout has a rectangular cross section.
10. The optoelectronic component according to claim 1 , wherein the electrically insulating film is at least one material selected from the group consisting of: polyimide, glass fiber reinforced epoxy, silicone and polymethacrylimide.
11. The optoelectronic component according to claim 1 , wherein the electrically insulating film is a film composite comprising glass fiber reinforced epoxy with a cover layer comprising polytetrafluoroethylene or polyetherimide.
12. The optoelectronic component according to claim 1 , wherein the electrically insulating film is the mechanically stabilizing element of the optoelectronic component.
13. The optoelectronic component according to claim 1 , wherein the electrically insulating film spans the at least two regions of the electrically conducting film insulated from each other.
14. The optoelectronic component according to claim 1 , wherein material of the electrically insulating film is arranged between the first connection region and the second connection region.
15. The optoelectronic component according to claim 1 , wherein both the electrically insulating film and the electrically conductive film are foil.
16. An optoelectronic component comprising:
a connection carrier comprising an electrically insulating film and an electrically conducting film with a connection face, wherein a top side of the connection carrier is formed by an outside surface of the electrically insulating film facing away from the electrically conducting film;
an optoelectronic semiconductor chip;
a potting body surrounding the optoelectronic semiconductor chip at the top side of the connection carrier, and
a cutout in the electrically insulating film at the top side of the connection carrier, wherein
the cutout does not completely penetrate through the electrically insulating film at least regionally,
an outer edge of the cutout facing the optoelectronic semiconductor chip has the function of a stop edge for the potting body,
the cutout is at least regionally free of the potting body,
the potting body extends at least regionally as far as the stop edge,
the potting body is in direct physical contact with the top side of the connection carrier,
the electrically conducting film is structured into a first region and a second region that are electrically insulated from one another,
the electrically insulating film completely covers the connection face of the electrically conducting film apart from a first connection region of the first region and a second connection region of the second region,
the optoelectronic semiconductor chip is arranged on the connection face of the electrically conducting film and electrically contact-connected to the connection face of the electrically conducting film in the second connection region, and
the cutout encloses the first and the second connection regions.
17. An optoelectronic component comprising:
a connection carrier that consists of an electrically insulating film, a connector, and an electrically conductive film with a connection face, wherein a top side of the connection carrier is formed by an outside surface of the electrically insulating film facing away from the electrically conducting film,
an optoelectronic semiconductor chip,
a potting body surrounding the optoelectronic semiconductor chip at the top side of the connection carrier, and
a cutout in the electrically insulating film at the top side of the connection carrier, wherein
the cutout does not completely penetrate through the electrically insulating film at least regionally,
an outer edge of the cutout facing the optoelectronic semiconductor chip has the function of a stop edge for the potting body,
the cutout is at least regionally free of the potting body,
the potting body extends at least regionally as far as the stop edge, and
the connector is arranged between the electrically conductive film and the electrically insulating film.