PASTE AND METHOD FOR CONNECTING ELECTRONIC COMPONENT TO SUBSTRATE
A paste may be used to connect at least one electronic component to at least one substrate through contact regions, wherein at least one of the contact regions contains a non-noble metal. The paste contains (a) metal particles, (b) at least one activator that bears at least two carboxylic acid units in the molecule, and (c) a dispersion medium. A method for connecting at least one electronic component to at least one substrate through the contact regions includes steps of providing a substrate having a first contact region and an electronic component having a second contact region; providing the above paste; generating a structure, wherein the first contact region of the substrate contacts the second contact region of the electronic component through the paste; and sintering the structure while producing a module including at least the substrate and the electronic component connected to each other through the sintered paste.
1 .- 10 . (canceled)
11 . A paste comprising:
(a) metal particles;
(b) at least one activator having at least two carboxylic acid units in its molecule; and
(c) a dispersion medium.
12 . The paste according to claim 11 , wherein the metal particles comprise silver particles.
13 . The paste according to claim 11 , wherein the activator has a decomposition point in a range of 100-300° C.
14 . The paste according to claim 11 , wherein the activator is selected from the group consisting of dicarboxylic acids and complexed dicarboxylic acids.
15 . The paste according to claim 14 , wherein the activator is selected from the group consisting of malonic acid, maleic acid, dimethylmalonic acid, and oxalic acid.
16 . The paste according to claim 11 , wherein the dispersion medium contains an aliphatic hydrocarbon compound.
17 . A method for connecting at least one electronic component to at least one substrate through contact regions, the method comprising the steps:
(i) providing a substrate having a first contact region and an electronic component having a second contact region, wherein at least one of the contact regions contains a non-noble metal;
(ii) providing a paste comprising:
(a) metal particles;
(b) at least one activator having at least two carboxylic acid units in its molecule; and
(c) a dispersion medium;
(iii) generating a structure, wherein the first contact region of the substrate contacts the second contact region of the electronic component through the paste; and
(iv) sintering the structure while producing a module comprising at least the substrate and the electronic component connected to each other through the sintered paste.
18 . The method according to claim 17 , wherein at least one of the contact regions is an integral component of the electronic component or of the substrate.
19 . The method according to claim 17 , wherein the non-noble metal comprises copper and the activator is selected from the group consisting of malonic acid, maleic acid, and oxalic acid.
20 . The method according to claim 17 , wherein the non-noble metal comprises nickel and the activator is selected from the group consisting of dimethylmalonic acid and oxalic acid.