IP Library › Granted Patent US 6,290,745
Granted Patent Utility
US 6,290,745 · App. 09/485,917

Method and device for producing soft solder powder

Inventors: Jurgen Schulze, Walter Protsch
Patented Case View Patent ↗
Granted: Sep 18, 2001 Filed: Feb 16, 2000
Inventors
Jurgen Schulze
Walter Protsch

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Quick Facts
Patent No.
US 6,290,745
App. No.
09/485,917
Filed
2000-02-16
Granted
2001-09-18
Kind
A