Core-jacket bonding wire
View Patent ↗A bonding wire is provided containing a wire core made of a first material containing a metal and a wire jacket that envelopes the wire core and is made of a second material containing a metal. The wire core and the wire jacket are made of different metals and the bonding wire has an aspect ratio of no more than 0.8. The bonding wire efficiently prevents damage to bonding surfaces during the bonding process and short-circuiting during the use of corresponding sub-assemblies.
1. A bonding wire comprising a wire core and a wire jacket fully enveloping the wire core, wherein the wire core comprises a first material selected from the group consisting of copper, copper alloys, and inter-metallic phases containing copper, and the wire jacket comprises a second material selected from the group consisting of aluminum, aluminum alloys, and inter-metallic phases containing aluminum, wherein the bonding wire has an aspect ratio of no more than 0.8, a thickness of the wire jacket is at least 10 microns, an area of the wire jacket comprises 5-50% of the cross-sectional area of the bonding wire, and the bonding wire has a rectangular cross section having a width in a range of 10 to 500 microns and a length in a range of 400 to 4000 microns, and wherein the aspect ratio is a ratio of the width to the length of the rectangular cross section of the bonding wire.
2. A sub-assembly comprising at least one substrate and a component, wherein the at least one substrate and the component are connected through a bonding wire according to claim 1 .
3. A method for producing a bonding wire according to claim 1 , comprising:
(i) providing a round wire comprising a wire core and a wire jacket enveloping the wire core, wherein the wire core comprises the first material and the wire jacket comprises the second material; and
(ii) reforming the round wire.
4. The method according to claim 3 , wherein the reforming comprises flat rolling the round wire.
5. The method according to claim 3 , wherein the reforming comprises drawing the round wire through a drawing die.
6. The sub-assembly according to claim 2 , wherein the bonding wire is connected to at least one of the substrate and the component by wedge-wedge bonding.