Copper bonding or superfine wire with improved bonding and corrosion properties
View Patent ↗A bonding or superfine wire is provided made of copper, with a gold enrichment on the surface thereof, in particular in an amount corresponding to a coating of at most 50 nm. The wire may be bonded by the ball/wedge method, has a copper-colored appearance, and the ball thereof after flame-off has a hardness of less than 95 according to HV0.002. In order to produce the bonding or superfine wire, a copper wire is coated with gold or a copper-gold alloy or gold is introduced into the surface of the copper wire. The wires are bonded to a semiconductor silicon chip.
1. A bonding or superfine wire, comprising a copper wire having gold enriched in a surface of the wire, wherein the bonding or superfine wire comprises a single phase system.
2. A bonding or superfine wire, comprising a copper wire containing gold in its surface, wherein the bonding or superfine wire comprises a single phase system and is bondable using a ball/wedge process.
3. A bonding or superfine wire according to claim 1 , wherein a quantity of gold enriched in the surface of the wire corresponds to a jacketing of at most 50 nm, if the gold were a uniform layer on the wire.
4. The bonding or superfine wire according to claim 3 , wherein the quantity of gold enriched in the wire surface corresponds to a jacketing of at most 20 nm, if the gold were a uniform layer on the wire.
5. The bonding or superfine wire according to claim 1 , wherein the bonding or superfine wire has a copper-colored appearance.
6. The bonding or superfine wire according to claim 1 , wherein the wire has a diameter of 25 μm and in a bonded-on condition has a loop schear-off strength>10 cN in a subsequent pressure cooker test (PCT) over 500 hrs.
7. The bonding or superfine wire according to claim 1 , wherein a concentration of the gold in the surface of the wire decreases toward its interior.
8. The bonding or superfine wire according to claim 1 , wherein the wire enriched with gold in its surface has a form of a flamed ball, wherein the flamed ball has a hardness according to HV0.002 of less than 95.
9. A ball/wedge process, the process comprising bonding a bonding or superfine wire made of copper onto a semiconductor silicon chip, wherein the wire is enriched with gold in its surface and comprises a single phase system.
10. A process for improving corrosion resistance of a bonding or superfine wire made of copper, the process comprising treating the copper wire with gold on its surface during manufacture of the bonding or superfine wire such that the treated bonding or superfine wire comprises a single phase system.
11. The process according to claim 10 , wherein the gold is worked into the surface of the copper wire.
12. The process according to claim 10 , wherein the gold is applied to the surface of the copper wire, or worked into its surface, in such a small amount that copper color in the bonding or superfine wire is still recognizable.
13. The bonding or superfine wire according to claim 1 , wherein the wire is storage stable for more than 100 hours unprotected from atmospheric influence.
14. A bonding or superfine wire manufactured according to the process of claim 10 , wherein the wire is storage stable for more than 100 hours unprotected from atmospheric influence.