Patent Assignment
Reel/Frame 027830/0077
Change of Name
Recorded: 2012-03-08
Pages: 11
Assignor
W.C. HERAEUS GMBH
Executed: 2011-07-18
Assignee
HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
HERAEUSSTRASSE 12-14, HANAU, 63450, GERMANY
Covered Properties
(58)
Process for the Manufacture of a Gauze for a Catalytic Converter and a Gauze for a Catalytic Converter Manufactured According Thereto
Patent:
5,232,891 →
Application:
07/749,296 →
Warp-Knit Fabric of Noble Metal-Containing Wires, and Method for the Production Thereof
Patent:
6,089,051 →
Application:
08/149,980 →
Process and Apparatus for Producing a Laminated Strip of a Metal Foil and a Plastic Film
Patent:
5,656,110 →
Application:
08/353,362 →
Cobalt Base Alloy Target for a Magnetron Cathode Sputtering System
Patent:
5,728,279 →
Application:
08/356,109 →
Wires Incorporating a Helical Component, Assemblies Thereof, and Use of Said Assemblies as Catalyser and/or to Recover Precious Metals
Patent:
5,699,680 →
Application:
08/379,478 →
Bath for the Electrodeposition of Palladium-Silver Alloys
Patent:
5,549,810 →
Application:
08/503,589 →
Cobalt Base Alloy Sputtering Target with High Magnetic Field Penetration
Patent:
6,372,104 →
Application:
08/572,792 →
Method of Manufacturing an Electrically Conductive Cermet
Patent:
5,796,019 →
Application:
08/583,516 →
Apparatus for Producing a Laminated Strip of a Metal Foil and a Plastic Film
Patent:
5,766,405 →
Application:
08/824,406 →
Crucible for Growing Single Crystals, Process for Making the Same and Use of the Same
Patent:
5,993,545 →
Application:
09/005,327 →
Fine Wire of Gold Alloy, Method for Manufacture Thereof and Use Thereof
Patent:
6,103,025 →
Application:
09/110,905 →
Method for Manufacturing a Welded Shaped Body Dispersion-Hardened Platinum Material
Patent:
6,129,997 →
Application:
09/266,142 →
Fine Wire Made of a Gold Alloy, Method for Its Production, and Its Use
Patent:
6,242,106 →
Application:
09/305,767 →
Method for Producing a Lead-Free Substrate
Patent:
6,352,634 →
Application:
09/445,196 →
Method and Device for Producing Soft Solder Powder
Patent:
6,290,745 →
Application:
09/485,917 →
Metal Component and Discharge Lamp
Patent:
6,384,533 →
Application:
09/506,063 →
Catalyst Assembly Comprising Catalyst Meshes and Ceramic Meshes
Patent:
6,455,020 →
Application:
09/652,755 →
Tube Target
Patent:
6,793,784 →
Application:
09/707,058 →
Method for Encapsulating Solder Metal Powders and Solder Metal Powders Produced According to This Method
Patent:
6,416,863 →
Application:
09/719,281 →
High-Pressure Discharge Lamp
Patent:
6,414,451 →
Application:
09/787,649 →
Sputtering Target for Depositing Silicon Layers in Their Nitride or Oxide Form and a Process for Its Preparation
Device for Producing Soft Solder
SIO2 -Glass Bulb with at Least One Current Lead-in, Process for Producing a Gas-Tight Connection Between Them, and Their Use in a Gas-Discharge Lamp
Gold-Free Platinum Material Dispersion-Strengthened by Small, Finely Dispersed Particles of Base Metal Oxide
Method and Apparatus for Reducing Nitrous Oxide
Process for Producing a Tube-Shaped Cathode Sputtering Target
Hollow Cylindrical Cathode Sputtering Target and Process for Producing It
Sputter Target Based on Titanium Dioxide
Hollow Cylindrical Cathode Sputtering Target and Process for Producing It
Module for a Data Carrier with Improved Bump Counterparts
High Temperature-Resistant Niobium Wire
Contact Arrangement and Use Thereof
Electrode System with a Current Feedthrough Through a Ceramic Component
Method for Refining and Homogeneously Distributing Alloying Partners and for Removing Undesirable Reaction Products and Slags in or from Soft Solder During the Production of Fine Solder Powder
No-Clean Low-Residue Solder Paste for Semiconductor Device Applications
Oxygen-Enriched Niobium Wire
Copper Bonding or Superfine Wire with Improved Bonding and Corrosion Properties
Doped Iridium with Improved High-Temperature Properties
Pt or Pt Alloy Materials Hardened by Oxide Dispersion, Produced by Inner Oxidation and Having Proportions of Oxide and Good Ductility
Pt/Pd Alloy Wires, Strips or Reshaped Parts Hardened by Oxide Dispersion, and Process of Producing the Same
Laminated Substrates for Mounting Electronic Parts and Methods for Making Same
Wire and Frame in Particular Niobium-Based for Single-Side Socket Lamps and a Method for the Production and Use Thereof
Solder Pastes Comprising Nonresinous Fluxes
Spool Wound with a Gold Alloy Wire Used for a Bonding Process
Process and Paste for Contacting Metal Surfaces
Application:
12/237,660 →
Publication:
US 2009/0134206
Magnetic Shunts in Tubular Targets
Bonding Wire
Application:
12/278,844 →
Publication:
US 2009/0022621
Composite Produced from Intermetallic Phases and Metal
Application:
12/295,360 →
Publication:
US 2011/0198983
Sputter Target Having a Sputter Material Based on TiO2 and Production Method
Application:
12/302,302 →
Publication:
US 2009/0183987
Method for the Decomposition of N2O in the Ostwald Process
Lead-Free Solder with Improved Properties at Temperatures >150¿C
Application:
12/444,283 →
Publication:
US 2010/0084050
Controlling the Porosity of Metal Pastes for Pressure Free, Low Temperature Sintering Process
Application:
12/548,039 →
Publication:
US 2010/0051319
Process and Paste for Contacting Metal Surfaces
Application:
12/615,516 →
Publication:
US 2010/0055828
Increasing the Strength of Iridium, Rhodium, and Alloys Thereof
Solder Material Comprising a Metal Stearate and Use of Metal Stearates in Solder Materials
Application:
13/001,820 →
Publication:
US 2011/0162871
Metal Fibers for Catalyst Non-Wovens
Material Comprised of Metal and Lactic Acid Condensate and Electronic Component
Application:
13/060,151 →
Publication:
US 2011/0151268
Treatment of Boron-Containing, Platinum Group Metal-Based Alloys
Application:
13/256,010 →
Publication:
US 2012/0000582
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest.
Aug 23, 1991
From: HORMANN, MICHAEL; KOTOWSKI, STEFAN; LUPTON, DAVID F.; REISS, WERNER
To: W. C. HEREAUS GMBH, A GERMAN CORP.
Reel/Frame 005854/0294 →
Assignment of Assignor's Interest
Nov 10, 1993
From: GORYWODA, MAREK; HORMANN, MICHAEL; LINDENMAYER, GUNTER; LUPTON, DAVID F.
To: W.C. HERAEUS GMBH
Reel/Frame 006771/0834 →
Assignment of Assignor's Interest
Dec 15, 1994
From: SCHLOTT, MARTIN; WEIGERT, MARTIN; TENG, KWEI; GEHMAN, BRUCE
To: LEYBOLD MATERIALS GMBH
Reel/Frame 007294/0230 →
Assignment of Assignor's Interest
Jan 31, 1995
From: GUERLET, JEAN-PAUL; LAMBERT, CLAUDE
To: COMPTOIR LYON ALEMAND LOUYOT
Reel/Frame 007466/0418 →
Assignment of Assignor's Interest
Feb 6, 1995
From: HERKLOTZ, GUNTER; ULLRICH, KARL-HEINZ; LOOSE, THOMAS; LACH, FRIEDRICH
To: W. C. HERAEUS GMBH
Reel/Frame 007314/0222 →
Assignment of Assignor's Interest
Jul 18, 1995
From: HERKLOTZ, GUNTER; FREY, THOMAS; CAMUS, OTTO
To: W.C. HERAEUS GMBH
Reel/Frame 007582/0790 →
Assignment of Assignor's Interest
Dec 15, 1995
From: SCHLOTT, MARTIN; HEINDEL, JOSEF
To: LEYBOLD MATERIALS GMBH
Reel/Frame 007808/0916 →
Assignment of Assignor's Interest
Jan 5, 1996
From: LUPTON, DAVID FRANCIS; SCHIELKE, JORG; GRAF, HANS-JOACHIM; RECKZIEGEL, ARNO
To: W.C. HERAEUS GMBH; FRIATEC AG
Reel/Frame 007822/0091 →
Corrective Assignment to Correct the Address of the Assignee Recorded on Reel 7582, Frame 790.
Jan 16, 1996
From: HERKLOTZ, GUNTER; FREY, THOMAS; CAMUS, OTTO
To: HERAEUS, W.C. GMBH
Reel/Frame 007850/0658 →
Assignment of Assignor's Interest
Jul 1, 1997
From: COMPTOIR LYON ALEMAND LOUYOT
To: ENGELHARD-CLAL SAS
Reel/Frame 008581/0649 →
Assignment of Assignor's Interest
Jan 9, 1998
From: LUPTON, DAVID FRANCIS; SCHIELKE, JORG; WEIGELT, MANFRED; PETERMANN, KLAUS
To: W.C. HERAEUS GMBH
Reel/Frame 008953/0913 →
Assignment of Assignor's Interest
Jul 6, 1998
From: HERKLOTZ, GUNTHER; REUEL, JURGEN; SCHRAPLER, LUTZ; SIMONS, CHRISTOPH
To: W.C. HERAEUS GMBH
Reel/Frame 009305/0203 →
Assignment of Assignor's Interest
Mar 10, 1999
From: BRAUN, FRANZ; KOCK, WULF; LUPTON, DAVID FRANCIS
To: W.C. HERAEUS GMBH & CO. KG
Reel/Frame 009820/0864 →
Change of Name
Apr 19, 1999
From: W.C. HERAEUS GMBH
To: W.C. HERAEUS GMBH & CO. KG
Reel/Frame 009912/0810 →
Change of Name
Apr 22, 1999
From: W. C. HERAEUS GMBH
To: W.C. HERAEUS GMBH & CO. KG.
Reel/Frame 009968/0936 →
Change of Name
May 20, 1999
From: W.C. HERAEUS GMBH
To: W.C. HERAEUS GMBH & CO. KG
Reel/Frame 009958/0482 →
Assignment of Assignor's Interest
Aug 27, 1999
From: HERKLOTZ, GUNTER; SCHRAPLER, LUTZ; SIMONS, CHRISTOPH; REUEL, JURGEN
To: W.C. HERAEUS GMBH & CO. KG
Reel/Frame 010207/0889 →
Assignment of Assignor's Interest
Feb 1, 2000
From: FORDERER, HEINZ; FREY, THOMAS; HERKLOTZ, GUNTER
To: W.C. HERAEUS GMBH & CO. KG
Reel/Frame 010580/0759 →
Assignment of Assignor's Interest
Feb 17, 2000
From: GIESEL, THOMAS; LUPTON, DAVID FRANCIS; KRUGER, FRANK; SCHOLZ, FRIEDHOLD
To: W.C. HERAEUS GMBH & CO. KG
Reel/Frame 010615/0970 →
Assignment of Assignor's Interest
Aug 31, 2000
From: GORYWODA, MAREK; LUND, JONATHAN
To: W.C. HERAEUS GMBH & CO. KG
Reel/Frame 011123/0964 →
Assignment of Assignor's Interest
Mar 20, 2001
From: BAAKE, REINHARD; LUPTON, DAVID FRANCIS
To: W. C. HERAEUS HOLDING GMBH & CO. KG
Reel/Frame 011740/0602 →
Assignment of Assignor's Interest
May 7, 2001
From: BACH, OTTO; LUPTON, DAVID; BOHMEIER, HANS; HECK, RALF
To: W. C. HERAEUS GMBH & CO.KG
Reel/Frame 011786/0492 →
Assignment of Assignor's Interest
Jul 19, 2001
From: WEIGERT, MARTIN; KONIETZKA, UWE
To: UNAXIS MATERIALS DEUTSCHLAND GMBH
Reel/Frame 012008/0259 →
Assignment of Assignor's Interest
Jul 30, 2001
From: FRIATEC AG
To: W.C. HERAEUS GMBH & CO. KG
Reel/Frame 012025/0603 →
Assignment of Assignor's Interest
Jul 31, 2001
From: SCHOLZ, FRIEDHOLD; LUPTON, DAVID; SCHIELKE, JORG; ZINGG, HOLGER
To: W. C. HERAEUS GMBH & CO. KG
Reel/Frame 012054/0943 →