Process and Paste for Contacting Metal Surfaces
For production of an electrically conductive or thermally conductive connection for contacting two elements, an elemental metal, in particular silver, is formed from a metal compound, in particular a silver compound, between the contact surfaces. In this production, the processing temperature for the use of a silver solder can be decreased below 240° C. and the processing pressure can be reduced to normal pressure. A contacting paste for this purpose contains a metal compound, in particular a silver compound, which decomposes below 400° C. while forming elemental silver. As a result, a metal is generated in situ from a chemical compound for producing a contact, which is usable above the temperature necessary for its production.
1 - 15 . (canceled)
16 . A process for producing an electrically conductive or thermally conductive connection for contacting two elements, comprising forming elemental silver in situ from a silver compound between contact surfaces of the two elements standing one over another.
17 . The process according to claim 16 , wherein the silver compound is selected from an organic silver compound or silver carbonate.
18 . The process according to claim 16 , wherein at least one of the contact surfaces has a non-precious metal in its surface.
19 . The process according to claim 16 , wherein the contacting process is carried out at a temperature below 400° C.
20 . The process according claim 16 , wherein the silver compound is present in a paste, which is deposited on one of the contact surfaces.
21 . A process for producing a full-surface metal contact between a metallic connection surface of an electronic component and a metallic connection surface of another component for fixing the components to each other at a temperature below 400° C., the process comprising applying to a contact surface of one of the components a material comprising a compound of metal or a component thereof, wherein the material decomposes below 400° C. into the metal or a component thereof, and wherein the metal or component thereof is one that melts just above 400° C., such that the metal contact is produced in situ by decomposition of the material below 400° C.
22 . The process according to claim 16 , wherein the contacting of the two elements comprises fastening:
a) of cooling bodies or LEDs or DCBs or solar cells; or
b) Si semiconductors on a Cu substrate; or
c) for a flip chip or Package on Package (PoP).
23 . A contacting paste containing a solid in an organic mass, wherein the organic mass is a gel and the solid comprises a silver compound, which decomposes below 400° C. with formation of elemental silver.
24 . The contacting paste according to claim 23 , wherein the contacting paste contains silver or copper particles.
25 . A process for connecting surfaces of electronic components using a contacting paste according to claim 23 , wherein at least one of the surfaces to be connected is made of a non-precious metal.
26 . A process for contacting two elements to form an electrically conducting or thermally conducting connection using the contacting paste according to claim 23 , wherein the contacting takes place at pressures up to 5 bar or at a processing temperature below 240° C. or at pressures up to 5 bar and a processing temperature below 240° C.
27 . The process according to claim 26 , wherein the process comprises low-pressure contacting in a field of power electronics or opto-electronics or for fastening LEDs or cooling bodies.
28 . A process for low-pressure contacting of components to form electronic modules using the contacting paste according to claim 23 , wherein the paste comprises a mixture of copper powder and a metal compound decomposable below 400° C.
29 . A process for metallic contacting between two metallic surfaces of two respective objects to form a module, the process comprising forming a metal contact by generating metal from a chemical compound below a maximum use temperature of the contact generated.
30 . A process for full-surface fastening of loose components to loose electrical components, comprising applying to a surface of at least one of the components a contacting paste according to claim 23 .