Sputter Target Having a Sputter Material Based on TiO2 and Production Method
A sputter target is provided having a sputter material based on TiO 2 and made such that the sputter material contains 15-60 mol. % Nb 2 O 5 . A method for the production of the sputter target includes the following steps: mixing of TiO 2 and Nb 2 O 5 powder in a liquid slurry; spray granulating this slurry to form TiO 2 :Nb 2 O 5 mixed oxide granulate; and plasma spraying this granulate onto a sputter target base body.
1 .- 5 . (canceled)
6 . A sputter target comprising a sputter material based on TiO 2 , wherein the sputter material contains 15-60 mol. % Nb 2 O 5 .
7 . The sputter target according to claim 6 , wherein the sputter material has a specific electrical resistance of <0.4 Ohm·cm.
8 . A sputter target comprising a sputter material based on TiO 2 , wherein the sputter material contains 1-60 mol. % Nb 2 O 5 and 0.02-1 mol. % In 2 O 3 .
9 . The sputter target according to claim 8 , wherein the sputter material has a specific electrical resistance of <0.4 Ohm·cm.
10 . Sputter target according to claim 8 , wherein the sputter material contains 15-40 mol. % Nb 2 O 5 .
11 . Sputter target according to claim 9 , wherein the sputter material contains 15-40 mol. % Nb 2 O 5 .
12 . A method for production of a sputter target according to claims 6 , comprising the following steps:
mixing TiO 2 and Nb 2 O 5 powder in a liquid slurry;
spray granulating the slurry to form TiO 2 :Nb 2 O 5 mixed oxide granulate; and
plasma spraying the granulate onto a sputter target base body.
13 . A method for production of a sputter target according to claims 8 , comprising the following steps:
mixing TiO 2 and Nb 2 O 5 powder in a liquid slurry;
spray granulating the slurry to form TiO 2 :Nb 2 O 5 mixed oxide granulate; and
plasma spraying the granulate onto a sputter target base body.