IP Library Granted Patent US 8,956,491
Granted Patent B2
US 8,956,491 · App. 13/439,993 · Granted Feb 17, 2015

Method for manufacturing a partially coated carrier structure

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,956,491
App. No.
13/439,993
Granted
Feb 17, 2015
Kind
B2
Abstract

A method is provided for manufacturing a partially coated carrier structure including a carrier tape coated by a coating. A protective film is applied to at least a portion of the coating, the coating is partially removed from the carrier tape, and the protective film is removed from the coating. A device for manufacturing a partially coated carrier structure by a method of this type includes a first conveying facility for conveying a carrier tape coated by a coating, an application facility for application of a protective film to at least a portion of the coating, and at least one tool that can be used to partially remove the coating from the carrier tape.

Claims (18)

1. A method for manufacturing a partially coated carrier structure comprising a carrier tape coated by a coating, the method comprising steps of:

applying a protective film to at least a portion of the coating in a first step;

partially mechanically removing the coating from the carrier tape with an edge of at least one peeling tool in a second step following the first step; and

removing the protective film from the coating remaining on the carrier tape in a third step following the second step,

wherein the protective film and the carrier tape coated by the coating are conveyed parallel to each other in certain areas in a same direction at a same conveying rate.

2. The method according to claim 1 , wherein the protective film is applied to the coating by gluing or adhesion.

3. The method according to claim 1 , wherein the protective film is removed from the coating by pulling off.

4. The method according to claim 1 , wherein the protective film is chemically removed from the coating.

5. The method according to claim 1 , wherein the coating is applied to the carrier tape by one of electroplating and roll cladding.

6. The method according to claim 1 , wherein at least one of the carrier tape, the carrier tape coated by the coating and the protective film is present as a continuous tape at least partially rolled up, and wherein the continuous tape is unrolled during the method.

7. The method according to claim 1 , wherein at least one of the protective film removed from the coating and the carrier structure manufactured by the method is rolled up as a continuous tape.

8. The method according to claim 7 , wherein a second protective film, optionally made of paper, is placed on the carrier structure before rolling up the carrier structure, and wherein the second protective film is rolled up together with the carrier structure.

9. The method according to claim 1 , wherein no protective film is applied to areas in which the coating is to be removed.

10. The method according to claim 1 , wherein the coating fully covers the carrier tape at least on one side of the carrier tape prior to at least partially removing the coating.

11. The method according to claim 1 , wherein the carrier tape comprises a metallic tape, the protective film comprises a plastic film, and the coating comprises a metallic coating.

12. The method according to claim 11 , wherein the metallic tape comprises a copper alloy, the plastic film is coated by adhesive on one side, and the metallic coating has a contactable surface.

13. The method according to claim 12 , wherein the copper alloy is CuSn 6 , the plastic film is a polyethylene terephthalate film, and the metallic coating is an Al—Si alloy.

14. The method according to claim 1 , wherein the second step further comprises generating at least one chip or residue from the coating, and wherein the third step further comprises removing the at least one chip or residue with the protective film.

Assignments (2)
CHANGE OF NAME Recorded May 19, 2015
From: HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 035744/0381 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 5, 2012
From: WACHTER, HANS-JURGEN; MULLER, JOHANNES; ROTH, JOSEF
To: HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
Reel/Frame 027994/0339 →