IP Library › Assignment 027843/0004
Patent Assignment
Reel/Frame 027843/0004

Assignment of Assignor's Interest

Recorded: 2012-03-12 Pages: 4
Assignors
LU, WEN-HSIUNG
Executed: 2012-02-08
WU, YI-WEN
Executed: 2012-02-08
LIN, CHIH-WEI
Executed: 2012-02-08
LIU, HSIU-JEN
Executed: 2012-02-08
CHENG, MING-DA
Executed: 2012-02-08
LIU, CHUNG-SHI
Executed: 2012-02-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property (1)
Package on Package Interconnect Structure
Patent: 9,607,921 →
Application: 13/349,405 →
Publication: US 2013/0181338
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Spelling of the Fourth Inventor's Last Name Previously Recorded on Reel 027843 Frame 0004. Assignor(S) Hereby Confirms the Assignment of Assignor's Interest. Feb 1, 2017
From: LU, WEN-HSIUNG; WU, YI-WEN; LIN, CHIH-WEI; LIN, HSIU-JEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 041582/0372 →