Patent Assignment
Reel/Frame 027850/0197
Assignment of Assignor's Interest
Recorded: 2012-03-13
Pages: 7
Assignee
SUMCO CORPORATION
2-1 SHIBAURA, 1-CHOME, MINATO-KU, TOKYO, 105-8634, JAPAN
Covered Property
(1)
Method and Apparatus for Producing Epitaxial Wafer