Patent Assignment
Reel/Frame 027852/0463
Assignment of Assignor's Interest
Recorded: 2012-03-13
Pages: 3
Assignor
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Executed: 2012-03-01
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 3, TAIWAN
Covered Property
(1)
Method of Separating Light-Emitting Diode from a Growth Substrate
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 8, 2009
From: CHEN, DING-YUAN; LIN, HUNG-TA; YU, CHEN-HUA; CHIOU, WEN-CHIH
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 023200/0329 →
Merger
Feb 23, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037805/0600 →
Change of Name
Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037809/0983 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →