Patent Assignment
Reel/Frame 027855/0623
Assignment of Assignor's Interest
Recorded: 2012-03-13
Pages: 3
Assignor
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Executed: 2012-03-01
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Light-Emitting Devices with Through-Substrate Via Connections
Application:
12/704,974 →
Publication:
US 2011/0198609
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 3, 2010
From: HUANG, HSIN-CHIEH
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 024326/0720 →
Merger
Dec 2, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037195/0793 →
Change of Name
Dec 2, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037457/0506 →