Patent Assignment
Reel/Frame 027857/0095
Assignment of Assignor's Interest
Recorded: 2012-03-13
Pages: 4
Assignors
LIN, CHUN-CHENG
Executed: 2012-03-01
LIU, CHUNG-SHI
Executed: 2012-03-01
HUANG, KUEI-WEI
Executed: 2012-03-01
CHEN, CHENG-TING
Executed: 2012-03-01
LIN, WEI-HUNG
Executed: 2012-03-01
CHENG, MING-DA
Executed: 2012-03-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Semiconductor Packaging Structure and Method