Patent Assignment
Reel/Frame 027861/0048
Assignment of Assignor's Interest
Recorded: 2012-03-14
Pages: 4
Assignor
YANG, HYUN MO
Executed: 2012-03-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Structure for Stacking Printed Board Assemblies in Electronic Device and Shielding Electronic Components Mounted on the Printed Board Assemblies