Patent Assignment
Reel/Frame 027866/0556
Assignment of Assignor's Interest
Recorded: 2012-03-15
Pages: 9
Assignors
LEE, DOSUN
Executed: 2012-02-23
YUN, KIYOUNG
Executed: 2012-02-24
PARK, YEONGLYEOL
Executed: 2012-02-24
CHOI, GILHEYUN
Executed: 2012-02-24
BAE, KISOON
Executed: 2012-02-23
MOON, KWANGJIN
Executed: 2012-02-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Including Stress Relief Structures