IP Library › Assignment 027884/0324
Patent Assignment
Reel/Frame 027884/0324

Assignment of Assignor's Interest

Recorded: 2012-03-15 Pages: 2
Assignors
CHIBA, JUN
Executed: 2012-02-01
TESHIMA, SATOSHI
Executed: 2012-02-06
KOBAYASHI, TASUKU
Executed: 2012-02-01
ANTOKU, YUKI
Executed: 2012-02-01
Assignee
TANAKA DENSHI KOGYO K.K.
TOKYO BUILDING 22F, 7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-6422, JAPAN
Covered Property (1)
Ag-Au-Pd Ternary Alloy Bonding Wire
Patent: 9,103,001 →
Application: 13/496,327 →
Publication: US 2012/0263624
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Record to Correct Execution Date on an Assignment Document Previously Recorded on March 15, 2012, Reel 027884/Frame 0324 Apr 3, 2012
From: CHIBA, JUN; TESHIMA, SATOSHI; KOBAYASHI, TASUKU; ANTOKU, YUKI
To: TANAKA DENSHI KOGYO K.K.
Reel/Frame 028009/0959 →