Patent Assignment
Reel/Frame 027885/0668
Assignment of Assignor's Interest
Recorded: 2012-03-19
Pages: 4
Assignors
LIN, JING-CHENG
Executed: 2012-01-31
HUNG, JUI-PIN
Executed: 2012-01-31
LIU, NAI-WEI
Executed: 2012-02-01
MAO, YI-CHAO
Executed: 2012-02-01
SHIH, WAN-TING
Executed: 2012-02-01
TUNG, TSAN-HUA
Executed: 2012-02-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Packaged Semiconductor Device with a Molding Compound and a Method of Forming the Same