Patent Assignment
Reel/Frame 027906/0214
Assignment of Assignor's Interest
Recorded: 2012-03-22
Pages: 3
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Method of Forming Trench in Semiconductor Substrate