Patent Assignment
Reel/Frame 027917/0254
Assignment of Assignor's Interest
Recorded: 2012-03-23
Pages: 3
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-8001, JAPAN
Covered Property
(1)
Substrate and Method for Mounting Semiconductor Package