Patent Assignment
Reel/Frame 027926/0838
Assignment of Assignor's Interest
Recorded: 2012-03-26
Pages: 5
Assignors
MERKLE, THOMAS
Executed: 2012-03-20
KOCH, STEFAN
Executed: 2012-03-20
CHOI, JOO-YOUNG
Executed: 2012-03-02
Assignee
SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
Covered Property
(1)
Method of Manufacturing a Package for Embedding One or More Electronic Components