Confirmatory Assignment

Recorded: 2012-03-26 Received: 2012-03-26 Pages: 5

Assignor

Executed: 2012-03-26

Assignee

NXP B.V.

HIGH TECH CAMPUS 60, EINDHOVEN, NLX, 5656 AG, NETHERLANDS

Covered Properties (13)

Reduced Profile Gift Card Holder

Application: 13/293,091 →

Insulated Shipping Containers

Application: 11/283,155 →

Electrical or Electronic Component and Method of Producing Same

Application: 10/492,120 →

Device for Forming Connection Elements

Application: 10/504,752 →

Insulated Shipping Containers

Application: 10/886,310 →

Multi-Chip Module Semiconductor Devices

Application: 10/301,200 →

Junction Temperatures Measurements in Semiconductor Chip Package Technology

Application: 10/282,450 →

Assembly with Connecting Structure

Application: 10/015,720 →

Chip-Mounted Contact Springs

Application: 10/005,689 →

Module Having a Lead Frame Equipped with Components on Both Sides

Application: 09/973,317 →

Semiconductor Devices

Application: 09/915,677 →

Semiconductor Module Having Multiple Semiconductor Chips

Application: 09/884,223 →

Semiconductor Device with Isolated Intermetal Dielectrics

Application: 09/829,797 →