IP Library › Assignment 027969/0574
Patent Assignment
Reel/Frame 027969/0574

Assignment of Assignor's Interest

Recorded: 2012-04-02 Pages: 5
Assignors
GRABBE, ALEXIS
Executed: 2012-03-30
RAGAN, TRACY M.
Executed: 2012-03-26
Assignee
MEMC SINGAPORE PTE. LTD. (UEN200614794D)
8 CROSS STREET, #11-00, PWC BUILDING, SINGAPORE, 048424, SINGAPORE
Covered Property (1)
Methods to Slice a Silicon Ingot
Patent: 8,505,733 →
Application: 13/272,885 →
Publication: US 2012/0024761
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Release of Security Interest Dec 26, 2013
From: GOLDMAN SACHS BANK USA
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0092 →
Change of Name Mar 29, 2017
From: MEMC SINGAPORE PTE. LTD. (UEN200614794D)
To: SUNEDISON PRODUCTS SINGAPORE PTE. LTD.
Reel/Frame 042110/0866 →
Assignment of Assignor's Interest Apr 27, 2017
From: SUNEDISON, INC.; SUNEDISON PRODUCTS SINGAPORE PTE. LTD.; MEMC PASADENA, INC.; SOLAICX
To: CORNER STAR LIMITED
Reel/Frame 042351/0659 →