Methods to slice a silicon ingot
View Patent ↗The present disclosure generally relates to methods for recovering silicon from saw kerf, or an exhausted abrasive slurry, resulting from the cutting of a silicon ingot, such as a single crystal or polycrystalline silicon ingot. More particularly, the present disclosure relates to methods for isolating and purifying silicon from saw kerf or the exhausted slurry, such that the resulting silicon may be used as a raw material, such as a solar grade silicon raw material.
1. A method for slicing a silicon ingot, the method comprising
contacting a surface of the silicon ingot with a reciprocating wire saw and a slurry comprising an organic lubricating fluid, an abrasive particulate, and a metal chelating agent soluble in the organic lubricating fluid,
wherein said contact of the surface of the silicon ingot with the reciprocating wire saw cause silicon particles from the ingot to be removed and form part of the slurry, the method further comprising:
mixing the slurry with an aqueous acid solution and allowing the mixture to separate into an aqueous phase and an organic phase, the aqueous phase comprising silicon particles and abrasive particulate and the organic phase comprising a complex formed between the chelating agent and metals;
collecting the aqueous phase comprising the silicon particles and the abrasive particulate; and
contacting aqueous phase comprising the silicon particles and the abrasive particulate with a source of iodine, in order to convert at least a portion of the silicon present therein to SiI 4 ; and
recovering at least a portion of the silicon particles from the aqueous phase by subjecting the aqueous phase to a density-dependent separation technique to separate the silicon particles and SiI 4 from the abrasive particulate, wherein the density-dependent separation technique is selected from sedimentation centrifugation, filtration centrifugation, and hydro-cyclone separation.
2. The method of claim 1 , wherein the chelating agent is an aldoxime.
3. The method of claim 1 wherein the abrasive particulate is silicon carbide.
4. The method of claim 1 wherein the recovered silicon particles have a carbon content of less than about 50 ppma.
5. The method of claim 1 wherein the recovered silicon particles have a content of metal contaminants of less than about 150 ppma.
6. The method of claim 1 , wherein the organic lubricating fluid is mineral oil.
7. The method of claim 1 wherein, prior to the density-dependent separation, the silicon particles are contacted with a liquid having a density between about 2.25 and about 3.35 gm/cm 3 to aid in the separation of silicon and abrasive particulate present therein.
8. The method of claim 7 , wherein the silicon particles are contacted with an aqueous heteropolytungstate solution.
9. A method for slicing a silicon ingot, the method comprising
contacting a surface of the silicon ingot with a reciprocating wire saw and a slurry comprising an organic lubricating fluid, an abrasive particulate, and a metal chelating agent soluble in the organic lubricating fluid,
wherein said contact of the surface of the silicon ingot with the reciprocating wire saw cause silicon particles from the ingot to be removed and form part of the slurry, the method further comprising:
mixing the slurry with an aqueous acid solution and allowing the mixture to separate into an aqueous phase and an organic phase, the aqueous phase comprising silicon particles and abrasive particulate and the organic phase comprising a complex formed between the chelating agent and metals;
collecting the aqueous phase comprising the silicon particles and the abrasive particulate;
drying the collected aqueous phase to thereby form a dry mixture comprising the silicon particles and the abrasive particulate;
separating at least a portion of the silicon particles from the abrasive particulate by subjecting the dried mixture to a non-uniform magnetic field.
10. The method of claim 9 , wherein the method further comprises:
creating a non-uniform magnetic field between a first pole and a second pole of the magnet;
aerosolizing the dried, solid particulate mixture; and
feeding the aerosol into the non-uniform magnetic field to separate silicon particles from abrasive grains present therein.
11. The method of claim 9 , wherein the organic lubricating fluid is mineral oil.
12. The method of claim 9 , wherein the chelating agent is an aldoxime.
13. The method of claim 9 , wherein the abrasive particulate is silicon carbide.
14. The method of claim 9 , wherein the recovered silicon particles have a carbon content of less than about 50 ppma.
15. The method of claim 9 , wherein the recovered silicon particles have a content of metal contaminants of less than about 150 ppma.