Patent Assignment
Reel/Frame 027989/0602
Assignment of Assignor's Interest
Recorded: 2012-04-04
Pages: 4
Assignors
AHN, JUNG-SEOK
Executed: 2012-04-02
JANG, DONG-HYEON
Executed: 2012-04-02
SONG, HO-GEON
Executed: 2012-04-02
IM, SUNG-JUN
Executed: 2012-04-02
JEON, CHANG-SEONG
Executed: 2012-04-02
LEE, TEAK-HOON
Executed: 2012-04-02
PARK, SANG-SICK
Executed: 2012-04-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Chip-Stacked Semiconductor Package