Assignment of Assignor's Interest

Recorded: 2012-04-05 Pages: 2

Assignors

WONG, YAM MO

Executed: 2012-03-23

KWAN, KA SHING

Executed: 2012-03-26

LI, HING LEUNG

Executed: 2012-03-16

LI, XIANG CHAO

Executed: 2012-03-23

Assignee

ASM TECHNOLOGY SINGAPORE PTE LTD

2 YISHUN AVENUE 7, SINGAPORE 768924, SINGAPORE

Covered Property (1)

Wire Bonder Including a Transducer, a Bond Head, and a Mounting Apparatus

Patent: 8,919,631 →

Application: 13/420,739 →

Publication: US 2013/0240605

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.