Patent Assignment
Reel/Frame 027998/0621
Assignment of Assignor's Interest
Recorded: 2012-04-05
Pages: 2
Assignors
LIN, JING-CHENG
Executed: 2012-03-20
LU, SZU WEI
Executed: 2012-03-20
PENG, I-HSUAN
Executed: 2012-03-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Semiconductor Device Packaging Methods and Structures Thereof