Patent Assignment
Reel/Frame 028025/0610
Assignment of Assignor's Interest
Recorded: 2012-04-11
Pages: 3
Assignor
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Executed: 2012-03-01
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Light Emitting Diode Light Bar Module with Electrical Connectors Formed by Injection Molding
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 7, 2010
From: LEE, HSIAO-WEN; SUN, CHIH-HSUAN; YEH, WEI-YU
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 025108/0608 →
Merger
Feb 23, 2016
From: LTD., CHIP STAR
To: EPISTAR CORPORATION
Reel/Frame 037805/0538 →
Change of Name
Feb 23, 2016
From: LTD., TSMC SOLID STATE LIGHTING
To: CHIP STAR LTD.
Reel/Frame 037805/0688 →