IP Library › Assignment 028032/0637
Patent Assignment
Reel/Frame 028032/0637

Assignment of Assignor's Interest

Recorded: 2012-04-12 Pages: 3
Assignor
Assignee
TSMC SOLID STATE LIGHTING LTD
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property (1)
Opto-Electronic Device Package with a Semiconductor-Based Sub-Mount Having Smd Metal Contacts
Patent: 8,729,591 →
Application: 12/426,796 →
Publication: US 2010/0210045
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 24, 2009
From: KUHMANN, JOCHEN F.; SHIV, LIOR
To: HYMITE A/S
Reel/Frame 022592/0238 →
Assignment of Assignor's Interest Jun 26, 2011
From: HYMITE A/S
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 026500/0235 →
Merger Feb 23, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037805/0584 →
Change of Name Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037809/0968 →