IP Library › Assignment 037809/0968
Patent Assignment
Reel/Frame 037809/0968

Change of Name

Recorded: 2016-02-23 Pages: 15
Assignor
TSMC SOLID STATE LIGHTING LTD.
Executed: 2015-04-02
Assignee
CHIP STAR LTD.
NO. 9 LIXING 4TH RD., HSINCHU SCIENCE AND INDUSTRIAL PARK, HSINCHU CITY, TAIWAN
Covered Properties (10)
Qfn/Son Compatible Package with Smt Land Pads
Patent: 8,786,165 →
Application: 11/521,828 →
Publication: US 2007/0063336
Formation of Through-Wafer Electrical Interconnections and Other Structures Using a Thin Dielectric Membrane
Patent: 7,531,445 →
Application: 11/669,664 →
Publication: US 2008/0076195
Light-Emitting Diode with Non-Metallic Reflector
Patent: 8,525,200 →
Application: 12/269,497 →
Publication: US 2010/0038661
Opto-Electronic Device Package with a Semiconductor-Based Sub-Mount Having Smd Metal Contacts
Patent: 8,729,591 →
Application: 12/426,796 →
Publication: US 2010/0210045
Light-Emitting Diode on a Conductive Substrate
Patent: 8,815,618 →
Application: 12/541,787 →
Publication: US 2010/0055818
Light-Emitting Diode with Embedded Elements
Patent: 8,742,441 →
Application: 12/547,428 →
Publication: US 2010/0059779
Laser Etch via Formation
Patent: 8,519,538 →
Application: 12/768,911 →
Publication: US 2011/0266674
Light Emitting Device
Patent: 8,476,659 →
Application: 12/837,227 →
Publication: US 2012/0012871
Micro-Interconnects for Light-Emitting Diodes
Patent: 8,653,542 →
Application: 13/005,731 →
Publication: US 2012/0181568
Shadow Mask Assembly
Patent: 9,000,455 →
Application: 13/792,136 →
Publication: US 2014/0252380
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Merger Feb 23, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037805/0584 →
Change of Name Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →