IP Library Granted Patent US 8,742,441
Granted Patent B2
US 8,742,441 · App. 12/547,428 · Granted Jun 3, 2014

Light-emitting diode with embedded elements

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Quick Facts
Patent No.
US 8,742,441
App. No.
12/547,428
Granted
Jun 3, 2014
Kind
B2
Abstract

A light-emitting diode (LED) device is provided. The LED device has a substrate and an LED structure overlying the substrate. Embedded elements are embedded within one or more layers of the LED structure. In an embodiment, the embedded elements include a dielectric material extending through the LED structure such that the embedded elements are surrounded by the LED structure. In another embodiment, the embedded elements only extend through an upper layer of the LED structure, or alternatively, partially through the upper layer of the LED structure. Another conductive layer may be formed over the upper layer of the LED structure and the embedded elements.

Claims (30)

1. A light-emitting diode (LED) device comprising:

a substrate;

an LED structure formed over the substrate, the LED structure having a lower LED layer, an active layer, and a first upper LED layer, wherein the first upper LED layer is a doped semiconductor layer; and

embedded elements continuously extending at least partially through the first upper LED layer and the active layer of the LED structure, the embedded elements having a refractive index different than the first upper LED layer, wherein the first upper LED layer and the embedded elements have co-planar upper surfaces that are facing the same direction.

2. The LED device of claim 1 , further comprising a second upper LED layer over the first upper LED layer.

3. The LED device of claim 1 , wherein the embedded elements extend through the lower LED layer.

4. The LED device of claim 1 , wherein at least a portion of the first upper LED layer is between the embedded elements and the active layer.

5. The LED device of claim 4 , wherein the embedded elements comprise a conductive material.

6. A light-emitting diode (LED) device comprising:

a substrate;

an LED structure over the substrate, the LED structure having a first conductive layer, an active layer, and a second conductive layer, wherein the first and second conductive layers include semiconductor materials doped with different types of conductivity;

embedded elements that each continuously extend at least partially through the first conductive layer and the active layer, the embedded elements having a refractive index different than a layer of the LED structure in which the embedded elements are embedded, wherein an uppermost surface of the embedded elements is co-planar with an upper surface of the first conductive layer; and

a third conductive layer located on the uppermost surface of the embedded elements and on the upper surface of the first conductive layer.

7. The LED device of claim 6 , wherein the embedded elements completely extend through the active layer of the LED structure.

8. The LED device of claim 6 , wherein the embedded elements extend only partially through the first conductive layer.

9. The LED device of claim 6 , wherein the LED structure comprises a conductive layer extending over the embedded elements.

10. The LED device of claim 6 , wherein the embedded elements are separated from the active layer of the LED structure.

11. The LED device of claim 6 , wherein the embedded elements comprise a conductive material.

12. A light-emitting diode (LED) device comprising:

a light emitting structure comprising multiple layers;

one or more refractive elements each continuously extending at least partially through at least two layers of the light emitting structure, the refractive elements having a refractive index different than layer of the light emitting structure in which the refractive elements are embedded, wherein the one or more refractive elements have flat top surfaces that are co-planar with a flat top surface of the light emitting structure, wherein a layer of the light emitting structure having the flat top surface is a doped semiconductor layer; and

a group III-V compound layer disposed on the flat co-planar top surfaces of the one or more refractive elements and the light emitting structure.

13. The LED device of claim 12 , wherein the refractive elements extend through an active layer of the light emitting structure.

14. The LED device of claim 12 , wherein the embedded elements extend only partially through an upper conductive layer of the light emitting structure.

15. The LED device of claim 12 , wherein the light emitting structure comprises a conductive layer extending over the refractive elements.

16. The LED device of claim 12 , wherein the refractive elements are separated from an active layer of the light emitting structure.

17. The LED device of claim 12 , wherein the refractive elements comprise a conductive material.

18. The LED device of claim 12 , wherein the light emitting structure comprises a lower conductive layer, an active layer, and an upper conductive layer.

19. The LED device of claim 2 , wherein the second upper LED layer is located over the co-planar surfaces of the first upper LED layer and the embedded elements.

20. The LED device of claim 1 , wherein the embedded elements include a dielectric material.

Assignments (5)
CHANGE OF NAME Recorded Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →
MERGER Recorded Feb 23, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037805/0584 →
CHANGE OF NAME Recorded Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037809/0968 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 13, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 027855/0797 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 28, 2009
From: CHEN, DING-YUAN; CHIOU, WEN-CHIH; YU, CHEN-HUA
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 023289/0421 →