Patent Assignment
Reel/Frame 028039/0170
Assignment of Assignor's Interest
Recorded: 2012-04-12
Pages: 2
Assignors
HSIEH, CHENG-CHIEH
Executed: 2012-03-30
HOU, SHANG-YUN
Executed: 2012-04-02
JENG, SHIN-PUU
Executed: 2012-03-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Integrated Thermal Solutions for Packaging Integrated Circuits