Patent Assignment
Reel/Frame 028060/0144
Assignment of Assignor's Interest
Recorded: 2012-04-17
Pages: 2
Assignors
CHEUNG, YIU MING
Executed: 2012-03-29
LO, TSAN YIN PETER
Executed: 2012-03-30
LI, MING
Executed: 2012-03-29
MAK, YICK HONG
Executed: 2012-03-29
LAM, KA SAN
Executed: 2012-03-29
Assignee
ASM TECHNOLOGY SINGAPORE PTE LTD
2 YISHUN AVENUE 7, SINGAPORE, 768924, SINGAPORE
Covered Property
(1)
Thermal Compression Bonding of Semiconductor Chips
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.