Patent Assignment
Reel/Frame 028084/0674
Assignment of Assignor's Interest
Recorded: 2012-04-20
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
PACKAGE-ON-PACKAGE (PoP) DEVICE WITH INTEGRATED PASSIVE DEVICE IN A VIA