Patent Assignment
Reel/Frame 028097/0412
Assignment of Assignor's Interest
Recorded: 2012-04-24
Pages: 2
Assignee
GLOBALFOUNDRIES INC.
MAPLES CORPORATE SERVICES LIMITED, PO BOX 309, UGLAND HOUSE, GRAND CAYMAN, KY1-1104, CAYMAN ISLANDS
Covered Property
(1)
Methods of Forming Bulk Finfet Devices So as to Reduce Punch Through Leakage Currents
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 2, 2018
From: GLOBALFOUNDRIES INC.
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 047039/0957 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Nov 19, 2025
From: TESSERA ADVANCED TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR ADVANCED TECHNOLOGIES INC.
Reel/Frame 073635/0304 →