Patent Assignment
Reel/Frame 047039/0957
Assignment of Assignor's Interest
Recorded: 2018-10-02
Pages: 8
Assignor
GLOBALFOUNDRIES INC.
Executed: 2018-09-25
Assignee
TESSERA ADVANCED TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(21)
Method for Reducing Electromigration in Semiconductor Interconnect Lines
Patent:
6,346,470 →
Application:
09/294,454 →
Sputter-Resistant Hardmask for Damascene Trench/via Formation
Patent:
6,121,150 →
Application:
09/296,557 →
Selective Deposition Process for Alloying Damascene-Type Cu Interconnect Lines
Patent:
6,689,689 →
Application:
09/477,821 →
Selective Deposition Process for Passivating Top Interface of Damascene-Type Cu Interconnect Lines
Method and Apparatus for Reducing Electromigration in Semiconductor Interconnect Lines
Patent:
6,563,222 →
Application:
09/999,703 →
Epitaxially Grown Fin for Finfet
Patent:
6,835,618 →
Application:
10/633,499 →
Epitaxially Grown Fin for Finfet
Patent:
7,183,152 →
Application:
10/975,475 →
Method for Forming a Self-Aligned Nitrogen-Containing Copper Silicide Capping Layer in a Microstructure Device
Methods for Fabricating Finfet Structures Having Different Channel Lengths
Adjusting Threshold Voltage for Sophisticated Transistors by Diffusing a Gate Dielectric Cap Layer Material Prior to Gate Dielectric Stabilization
Methods for Fabricating Finfet Structures Having Different Channel Lengths
Semiconductor Device with Embedded Low-K Metallization
Patent:
8,222,103 →
Application:
13/027,739 →
Multilayer Interconnect Structure and Method for Integrated Circuits
Methods for Fabricating Finfet Integrated Circuits in Bulk Semiconductor Substrates
Integrated Circuits and Methods for Processing Integrated Circuits with Embedded Features
Patent:
8,431,482 →
Application:
13/362,981 →
Adjusting Threshold Voltage for Sophisticated Transistors by Diffusing a Gate Dielectric Cap Layer Material Prior to Gate Dielectric Stabilization
Methods of Forming Bulk Finfet Devices So as to Reduce Punch Through Leakage Currents
Methods of Forming a Finfet Semiconductor Device with Undoped Fins
Integrated Circuits and Methods for Processing Integrated Circuits with Embedded Features
Multilayer Interconnect Structure and Method for Integrated Circuits
Methods of Forming a Finfet Semiconductor Device with Undoped Fins
Related Assignments
(18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 5, 2003
From: DAKSHINA-MURTHY, SRIKANTESWARA; YANG, CHIH-YUH; YU, BIN
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 014369/0846 →
Assignment of Assignor's Interest
Sep 12, 2007
From: STRECK, CHRISTOF; KAHLERT, VOLKER
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 019815/0423 →
Assignment of Assignor's Interest
Apr 15, 2009
From: JOHNSON, FRANK S.; SCHULTZ, RICHARD T.
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 022550/0529 →
Affirmation of Patent Assignment
Aug 18, 2009
From: ADVANCED MICRO DEVICES, INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 023120/0426 →
Affirmation of Patent Assignment
Aug 18, 2009
From: ADVANCED MICRO DEVICES, INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 023119/0083 →
Assignment of Assignor's Interest
May 25, 2010
From: CARTER, RICHARD; TRENTZSCH, MARTIN; BEYER, SVEN; PAL, ROHIT
To: GLOBALFOUNDRIES INC.
Reel/Frame 024438/0793 →
Assignment of Assignor's Interest
Feb 15, 2011
From: BAARS, PETER; SCHLOESSER, TILL
To: GLOBALFOUNDRIES INC.
Reel/Frame 025811/0025 →
Assignment of Assignor's Interest
Apr 28, 2011
From: KIM, RYOUNG-HAN
To: GLOBALFOUNDRIES INC.
Reel/Frame 026197/0574 →
Assignment of Assignor's Interest
Aug 15, 2011
From: CHO, JIN
To: GLOBALFOUNDRIES INC.
Reel/Frame 026752/0151 →
Assignment of Assignor's Interest
Jan 31, 2012
From: RYAN, ERROL T.; ZHANG, XUNYUAN
To: GLOBALFOUNDRIES INC.
Reel/Frame 027629/0092 →
Assignment of Assignor's Interest
Apr 24, 2012
From: FAUL, JUERGEN; JAKUBOWSKI, FRANK
To: GLOBALFOUNDRIES INC.
Reel/Frame 028097/0412 →
Assignment of Assignor's Interest
Dec 12, 2012
From: WEI, ANDY C.; SEHGAL, AKSHEY; KIM, SEUNG Y.; TANG, TECK JUNG
To: GLOBALFOUNDRIES INC.
Reel/Frame 029451/0163 →
Assignment of Assignor's Interest
Apr 22, 2013
From: RYAN, ERROL TODD; ZHANG, XUNYUAN
To: GLOBALFOUNDRIES INC.
Reel/Frame 030260/0554 →
Assignment of Assignor's Interest
May 6, 2013
From: RYAN, ERROL T.; ZHANG, XUNYUAN
To: GLOBALFOUNDRIES INC.
Reel/Frame 030358/0097 →
Assignment of Assignor's Interest
Oct 29, 2013
From: KIM, RYAN RYOUNG-HAN
To: GLOBALFOUNDRIES INC.
Reel/Frame 031507/0484 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Sep 23, 2024
From: TESSERA ADVANCED TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR ADVANCED TECHNOLOGIES INC.
Reel/Frame 069019/0067 →
Change of Name
Nov 19, 2025
From: TESSERA ADVANCED TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR ADVANCED TECHNOLOGIES INC.
Reel/Frame 073635/0304 →