Patent Assignment
Reel/Frame 026197/0574
Assignment of Assignor's Interest
Recorded: 2011-04-28
Pages: 3
Assignor
KIM, RYOUNG-HAN
Executed: 2011-04-27
Assignee
GLOBALFOUNDRIES INC.
MAPLES CORPORATE SERVICES LIMITED PO BOX 309, UGLAND HOUSE, GRAND CAYMAN, KY1-1104, CAYMAN ISLANDS
Covered Property
(1)
Multilayer Interconnect Structure and Method for Integrated Circuits
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 2, 2018
From: GLOBALFOUNDRIES INC.
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 047039/0957 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Sep 23, 2024
From: TESSERA ADVANCED TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR ADVANCED TECHNOLOGIES INC.
Reel/Frame 069019/0067 →