Granted Patent
Utility
US 6,121,150 · App. 09/296,557
Sputter-resistant hardmask for damascene trench/via formation
Inventors:
Steven C. Avanzino, Fei Wang
Patented Case
View Patent ↗
Granted: Sep 19, 2000
Filed: Apr 22, 1999
Inventors
Steven C. Avanzino
Fei Wang
Assignee (at issue)
Advanced Micro Devices, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.