Corrective Assignment to Correct the Inventorship of This Application by Removing Inventors - in Sung Kim; Chien Yun Tao; Jeong Il Kang Previously Recorded on Reel 024451 Frame 0565. Assignor(S) Hereby Confirms the Inventors Yong Won Cha and Dong Chul Kim Are the Correct Inventors for This Application.

Recorded: 2012-04-26 Pages: 4

Assignors

CHA, YONG WON

Executed: 2012-02-20

KIM, DONG CHUL

Executed: 2012-02-20

Assignee

LTRIN CO., LTD

104-2, GAJANG-DONG, OSAN-SI, GYEONGGI-DO, 447-210, KOREA, REPUBLIC OF

Covered Property (1)

Wafer Cleaning Method and Wafer Bonding Method Using the Same

Patent: 8,278,186 →

Application: 12/602,285 →

Publication: US 2010/0261332

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.