IP Library Assignment 028120/0003
Patent Assignment
Reel/Frame 028120/0003

Assignment of Assignor's Interest

Recorded: 2012-04-27 Pages: 3
Assignors
KUSHIBE, MITSUHIRO
Executed: 2012-02-21
OHBA, YASUO
Executed: 2012-02-21
KATSUNO, HIROSHI
Executed: 2012-02-21
KANEKO, KEI
Executed: 2012-02-21
YAMADA, SHINJI
Executed: 2012-02-22
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Semiconductor Device, Wafer, Method for Manufacturing Semiconductor Device, and Method for Manufacturing Wafer
Patent: 8,937,325 →
Application: 13/406,740 →
Publication: US 2013/0069033
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 1, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: ALPAD CORPORATION
Reel/Frame 044591/0755 →