Patent Assignment
Reel/Frame 028141/0115
Assignment of Assignor's Interest
Recorded: 2012-05-02
Pages: 5
Assignors
LIBBERT, JEFFREY L.
Executed: 2012-03-26
FEI, LU
Executed: 2012-04-25
STANDLEY, ROBERT W.
Executed: 2012-03-29
Assignee
MEMC ELECTRONIC MATERIALS, INC.
501 PEARL DRIVE, ST. PETERS, MISSOURI, 63376
Covered Property
(1)
Silicon on Insulator Structures Having High Resistivity Regions in the Handle Wafer
Application:
13/419,137 →
Publication:
US 2012/0235283
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jan 30, 2014
From: SUNEDISON, INC.; SOLAICX; SUN EDISON, LLC; NVT, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 032177/0359 →
Release of Security Interest
Mar 3, 2014
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC.
Reel/Frame 032382/0724 →
Assignment of Assignor's Interest
May 27, 2014
From: MEMC ELECTRONIC MATERIALS, INC.
To: SUNEDISON SEMICONDUCTOR LIMITED (UEN201334164H)
Reel/Frame 033023/0430 →