Patent Assignment
Reel/Frame 028151/0185
Assignment of Assignor's Interest
Recorded: 2012-05-03
Pages: 4
Assignors
LIN, CHENG-CHUNG
Executed: 2012-02-09
HUANG, KUEI-WEI
Executed: 2012-02-09
ANG, AI-TEE
Executed: 2012-02-09
TSAI, TSAI-TSUNG
Executed: 2012-02-09
CHENG, MING-DA
Executed: 2012-02-09
LIU, CHUNG-SHI
Executed: 2012-02-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Fine-Pitch Package-on-Package Structures and Methods for Forming the Same